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Manufacturing, microstructure and mechanical properties of selective laser melted Ti6Al4V-Cu

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dc.contributor.author Kinnear, A.
dc.contributor.author Dzogbewu, T. C.
dc.contributor.author Krakhmalev, P.
dc.contributor.author Yadroitsava, I.
dc.contributor.author Yadroitsev, I.
dc.date.accessioned 2018-11-20T12:26:45Z
dc.date.available 2018-11-20T12:26:45Z
dc.date.issued 2017
dc.identifier.uri http://hdl.handle.net/11462/1759
dc.description Conference Proceedings en_US
dc.description.abstract Ti6Al4V is a commonly used biomedical alloy because of its suitable mechanical and biocompatible properties. Infection at the bone–implant interface is the most probable reason for implant failure directly after implantation. Copper is a proven anti-bacterial agent and in small amounts is not toxic to the human body. Copper additions reduce the risk of bacterial infection and implant failure. Thus advanced implants can be constructed to have a biocompatibility and antibacterial properties. Optimal process parameters are needed to be established for in-situ alloying of Ti6Al4V-Cu to form dense parts with suitable mechanical properties. The effect of laser scanning speeds and hatch distance on morphology of single layers was investigated. The surface roughness, chemical composition and distribution of Cu near the surface and within the synthesized layer, as well as micro hardness were considered. An employed rescanning strategy showed improved alloy homogeneity and surface quality. On the base of these data 3D samples were produced. Microstructure and mechanical properties of as-built parts were analysed. en_US
dc.format.extent 1 698 448 bytes, 1 file
dc.format.mimetype Application/PDF
dc.language.iso en_US en_US
dc.publisher LiM "Lasers in manufacturing" conference, Munich, en_US
dc.subject Ti alloys en_US
dc.subject implants en_US
dc.subject antibacterial properties en_US
dc.subject microstructure en_US
dc.title Manufacturing, microstructure and mechanical properties of selective laser melted Ti6Al4V-Cu en_US
dc.type Presentation en_US

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